Senior Manager | Chip-to-Package Power Technology

We are looking for an experienced Senior Engineer/Manager specializing in Chip-to-Package Interaction for Power Applications. The ideal candidate will have 5+ years of experience in assessing and qualifying chip-to-package interactions and advanced power assembly solutions. This role requires expertise in failure mechanisms, die-to-package interaction phenomena, and collaboration with Assembly R&D, Manufacturing, Quality, and Product teams to ensure robust technology integration.

Key Responsibilities:

• Define, in collaboration with the Assembly/Back-end R&D team, the qualification activities required to secure product quality.
• Identify technical risks related to the integration of new power devices into new packages/power modules.
• Define Front-End process requirements to ensure compatibility with new power packaging solutions.
• Collaborate with the Assembly R&D team to develop a package roadmap aligned with power product requirements.

Technical Expertise:

• Chip-to-package interaction mechanisms and failure analysis.
• Knowledge of power package and assembly processes (e.g., sintering, soldering).
• Understanding of power front-end technology and integration of key components (e.g., power metallization, back-side finishing).
• Expertise in power semiconductor device reliability, with a focus on chip-package interaction failure mechanisms.
• Strong foundation in power device physics and its applications.

Profile:

• 5+ years of experience in chip-to-package interaction assessment and qualification.
• Ability to manage technical teams and collaborate across R&D, manufacturing, and quality functions.
• Strong analytical skills and a proactive approach to problem-solving in power semiconductor packaging.

If you are passionate about power device packaging innovation and ensuring the reliability and quality of advanced power solutions, we’d love to hear from you.